This thesis work has been performed at the Division of Assembly Technology at Linköping University for a period of ten weeks. The work is part of the project ProFlexA, which is a research project in collaboration between Linköping University, Lund University, and industrial partners such as Combi Wear Parts and Smålands Stålgjuteri AB.The casting process creates random incurred burrs and defects, which must be removed during a cleaning process to make sure that the cast can be sold. Automation has long been sought for the cleaning of castings due to, among other things, poor working conditions for staff, but this has proved difficult to implement with today's technology. Automation has for some time been available for more capital strong companies with large annual volumes, but for smaller companies with small-and medium-sized volumes, automation has not been an option.The goal of ProFlexA is to develop an automated cleaning cell aimed at small-and medium-sized volumes.The goal of the thesis is to do a pre study at ProFlexA?s partners on cleaning of castings, and develop concepts for automated cleaning of castings.By recording the process and cycle times, the cleaning of castings has been documented as it works today, and on this basis, information and statistics has been compiled.

In this Master thesis, microwave connections between circuit boards are constructed. The primary frequency band is the X-band (8-12 GHz). The purpose of the connections is to enable a more simple and cheaper way of mounting the circuit boards inside a container. The connections have been designed and evaluated, using different computer programs. A few prototypes have been built and measured.

This study investigated the possibility of implementing three standards, Transistion Minimized Differential Signaling (TMDS) and two versions of Stub Series Terminated Logic (SSTL), for inter-chip communication in a specific manufacturing process. The two SSTL standards were implemented in one transceiver system while TMDS was implemented in a separate system. The evaluation was done with Spice simulations on schematic level with some parasitic capacitance and resistance. The idea was to investigate the possibility of implementing these standards and get an idea of eventual shortcomings. In order to create models as a basis for evaluation, simulation environments with models for circuit board and packages were created and transmitters and receivers were designed.